Panel – Enabling Next Generation Architectures: 224 Gbps Electrical Interfaces
Next generation 200 to 224 Gbps equipment architectures will undoubtedly exist, and they will need power efficient high speed electrical interfaces to enable them. A panel of OIF experts will present the Common Electrical I/O (CEI) work the OIF is doing to address electrical interfaces that are optimized for new electrical and optical architecture aspirations. At 112 Gbps, OIF recently delivered the industry's first electrical interface focused on enabling co-packaging and now that work is continuing for 224 Gbps. In addition, OIF is addressing interfaces such as VSR (chip to module), LR (backplane) and Linear optical interfaces. This session will include the lessons learned from 112 Gbps and how those lessons are being leveraged for the new 224 Gbps work. The session will also discuss the challenges OIF must overcome to enable 224 Gbps electrical I/O interface solutions where the reach, performance, power, and cost optimizations become paramount to keep the industry moving forward with a next generation of interoperable electrical I/O interface specifications that address the escalating network power consumption trends.
2-Day Pass, All Access Pass, Expo Pass
High-speed Communications, Infrastructure