Panel – Enabling Next Generation Co-Packaging Solutions
Co-packaging of optical and electrical interfaces with ASICs has generated a lot of interest in the industry. The end customers are motivated to find solutions to improve density and reduce power consumption. Co-packaging can help achieve these goals and involves integrating many new technologies together, electrical, optical, thermal, advanced packaging techniques, as well as new software management interfaces.
A panel of OIF experts will summarize the OIF's work on studying the various co-packaging applications, the various technical tradeoffs and choices between different approaches, the OIF's projects, as well as future trends in co-packaging. Finally, the panel will cover a key aspect of the OIF's work which is to create standards (interoperability agreements) which foster the development of a co-packaging eco-system.
2-Day Pass, All Access Pass, Expo Pass
Data Centers, High-speed Communications