Panel – Enabling Next Generation Co-Packaging Solutions

Event Time

Originally Aired - Tuesday, January 31 4:45 PM - 6:00 PM Pacific Time (US & Canada); Tijuana

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Event Location

Location: Ballroom D


Event Information

Title: Panel – Enabling Next Generation Co-Packaging Solutions

Description: Co-packaging of optical and electrical interfaces with ASICs has generated a lot of interest in the industry. The end customers are motivated to find solutions to improve density and reduce power consumption. Co-packaging can help achieve these goals and involves integrating many new technologies together, electrical, optical, thermal, advanced packaging techniques, as well as new software management interfaces.



A panel of OIF experts will summarize the OIF's work on studying the various co-packaging applications, the various technical tradeoffs and choices between different approaches, the OIF's projects, as well as future trends in co-packaging. Finally, the panel will cover a key aspect of the OIF's work which is to create standards (interoperability agreements) which foster the development of a co-packaging eco-system.

Type: Panel Discussion

Pass Type: 2-Day Pass, All Access Pass, Expo Pass

Theme: Data Centers, High-speed Communications


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