Title:
Panel – Test on Wheels: Test & Measurement for Automotive Standards
Description:
In its second year, the Test on Wheels Panel will share insights into how the automotive industry is approaching the unique physical layer challenges on noisy, hot/cold, wet/icy, and sometimes violent streets.
High-speed automotive SERDES tech has evolved since last year. The first compliance test suites (CTS) have been created, the first chipsets designed and manufactured, the first test solution exists, and the first test event has taken place. This year's panel will focus on lessons learned by the people who design the SERDES and interconnect technology and define the standards that promise component interoperability – what can and can't be leveraged from established HSS standards like 400G Ethernet, PCIe, and USB, and what must be developed.
It's a unique opportunity to hear, question, and offer advice to the people driving automotive chipset design, integration of ECUs (electronic control units) and chipsets, tests and test equipment, final integration, and standards. Panelists will share their experiences and question each other's assumptions and expectations in a robust conversation about the best way to create a testing eco-system appropriate for technology on wheels.
This is the story of how our relationship with cars is changing – internal combustion, electric, and self-driving vehicles – told from the PHY layer.
Type:
Panel Discussion
Pass Type:
2-Day Pass, All Access Pass, Expo Pass
Theme:
Automotive, High-speed Communications