Panel – Real-World Deployment of AI/ML in Chip & Board Applications

Event Time

Originally Aired - Tuesday, January 31 4:45 PM - 6:00 PM Pacific Time (US & Canada); Tijuana

Info Alert

Create or Log in to My Show Planner to see Videos and Resources.

Videos

Resources

Create or Log in to My Show Planner to see Videos and Resources.


{{chatHeaderContent}}

{{chatBodyContent}}

Resources

Create or Log in to My Show Planner to see Videos and Resources.


Info Alert

This Session Has Not Started Yet

Be sure to come back after the session starts to have access to session resources.

Info Alert

You do not have access to videos and resources for this session.

Event Location

Location: Ballroom C


Event Information

Title: Panel – Real-World Deployment of AI/ML in Chip & Board Applications

Description: Seemingly anyone associated with chips or boards clamored to learn more about artificial intelligence and machine learning techniques as the terminology became part of the semiconductor industry jargon. Then venture capitalists funded startups designing AI chips also called AI accelerators to process AI tasks faster using less power and promising an extraordinary impact on the semiconductor industry and society.

Now several years into the AI/ML push, DesignCon invites attendees to join experts from the chip and board community as they explore the advances and spotlight real-world AI/ML deployment examples across the semiconductor supply chain. They will highlight the benefits derived from implementing AI/ML as well as address any drawbacks or disruptions caused by this innovation.

Panel moderator Ed Sperling, Editor-in-Chief of Semiconductor Engineering, will conclude the discussion by asking panelists to look to the future and offer a glimpse of what's to come.

Audience participation will be encouraged.

Type: Panel Discussion

Pass Type: 2-Day Pass, All Access Pass, Expo Pass

Theme: Infrastructure, Automotive


Tracks


Speakers


Notes

Create or Log in to My Show Planner to see Notes